New BGA Interposers from Advanced Interconnections are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles. Designed for RoHS exempt applications, Interposers from Advanced solve BGA device transition, obsolescence, and solderability issues associated with the higher temperature requirements to process lead-free BGA packages. Advanced's turn-key solution consists of lead-free BGA device attach to an Interposer adapter board in a high temperature reflow process, followed by mounting of eutectic (63/37) Tin/Lead solder balls on the bottom of the Interposer. The compact Interposer assembly is shipped ready for use on existing PC boards, eliminating the need to change Tin/Lead solder profiles or subject other components to higher processing temperatures.

Advanced offers a complete Interposer solution including high temperature, FR-4 adapter boards that closely match the original package size, industry-proven eutectic (63/37) Tin/Lead solder balls, and in-house lead-free BGA device attach. Device-specific Interposers match the device footprint and are currently available in 0.80, 1.00, and 1.27mm pitch. Tape and professional reel packaging is available. Pricing varies by pin count and quantity. Typical lead time is 4-6 weeks. Submit device package mechanical specifications along with quantity requirements for quotation.