September 16, 2008 - Liqui-Bond SA 1800 (One Part)
The Bergquist Company is excited to announce the addition of another high performance product, Liqui-Bond SA 1800, to its liquid silicone adhesive family. Liqui-Bond SA 1800 features both a high thermal conductivity (1.8 W/m-K) and a low viscosity, allowing for ease of screen or stencil application. The material is also well suited for high volume automated dispensing. Liqui-Bond SA 1800 is a one-part material that cures and bonds at elevated temperatures and eliminates the need for mechanical fasteners, reducing labor, cost and complexity.

Features and Benefits

•High thermal conductivity: 1.8W/m-K
•Eliminates need for mechanical fasteners
•Low viscosity for ease of screening or stenciling
•Maintains structural bond in severe-environment applications
•Heat cure
Liqui-Bond SA 1800 is a high performance, liquid silicone adhesive that cures to a solid bonding elastomer. The adhesive is supplied as a one-part liquid component, offered in a tube or mid-size container.
Liqui-Bond SA 1800 features a both a high thermal conductivity and a low viscosity, allowing for ease of screen print or stencil application. This material is also ideal for high volume automated pattern dispensing. Liqui-Bond SA 1800’s low viscosity allows the material to achieve a very thin bond line, producing excellent thermal performance and a high shear strength.
Liqui-Bond SA 1800’s mild elastic properties assist in relieving CTE stresses during thermal cycling. The material cures at elevated temperatures and requires refrigeration storage at 10°C. Liqui-Bond SA 1800 is available with optional glass beads to provide a consistent stand-off and ensure dielectric integrity.

Typical Applications Include:

•PCB assembly to housing
•Discrete component to heat spreader