Böllhoff and DELO: Process-safe adhesing of threads

What have metal cases and metal thread elements to do with the plastics trade fair K 2007, some or the other visitor to the Böllhoff booth in October might wonder. The answer is simple: Böllhoff Verbindungstechnik GmbH based in Bielefeld introduces a new, customised joining procedure for attaching fastening elements to wafer-thin metal sheets: The adhering system is ideal for mobile phone housings. It has been developed together with DELO Industrie Klebstoffe based in Landsberg / Lech. Industrial adhesive plays an important role in this system.
The highest priority when developing the innovative joining process was process-safe curing within ideal cycle times and geometric design. A threaded bush is used which is provided with sufficient adherend due to an enlargement in diameter in the lower area. The resulting cavity provides reproducable layer thicknesses and ensures that the adhesive suffuses the complete joining part surfaces. The benefit: Spare adhesive and particularly enclosed air leak out through a drilling hole into the interior of the threaded bush. The adhesion process is carried out in three easy steps: Application of adhesive, setting of the thread element and curing.
Highly flexible dual-curing acrylates are used. That way, the components easily survived the so-called "Random Free Fall Test" (ten falls from a height of 1.5 meters onto a stone floor). Another benefit is that the adhesive cures within seconds.
If you are interested, you can find out more at the plastics trade fair K 2007 in Düsseldorf at the end of October at the Böllhoff booth (hall 5 / booth B43).
Böllhoff Verbindungstechnik GmbH based in Bielefeld and DELO Industrie Klebstoffe have developed a new adhesion system to process-safely attach thread elements to wafer-thin metal housings of mobile phones or handheld devices.