Master Bond Polymer System EP39MHT is a unique high performance epoxy compound which combines easy processability with outstanding physical strength properties. These include superior electrical insulation, chemical inertness and service up to 230°C. It is a two component system which cures readily at ambient or more quickly at elevated temperatures. The cured epoxy is a tough strong thermoset solid featuring desirable physical, electrical and chemical characteristics together with outstanding resistance to thermal and/or mechanical shocks. It is 100% reactive and does not contain any volatiles. Master Bond Polymer System EP39MHT has proven especially attractive for potting, encapsulation, and bonding applications requiring minimal shrinkage and stress development, as it develops very little heat during the curing reaction. It has also been found to be particularly useful for potting thick sections with complicated configurations up to several inches.


Adhesion to both similar and dissimilar substrates such as metals, glass, ceramics, woods, vulcanized rubbers and many plastics is excellent. Service temperature range extends from -60°C to 230°C. Master Bond Polymer System EP39MHT has found wide acceptance in the electronic, electrical, computer, optoelectronic and aerospace industries.