• How high is the thermal conductivity of the electronic component?
• Is the chip underfiller sufficiently cured?
• At what temperature does the lead-free solder melt?

The Analyzing & Testing Business Unit at NETZSCH can answer these and similar questions in the fields of thermal analysis and thermophysical properties testing.
At the Productronica 2007 in Munich, state-of-the-art instrument techniques tailored to the electronic industry will be presented:

DSC 200 F3 Maia® with automatic sample changer for measurements of glass transition, melting, crystallization, reaction, specific heat and oxidation stability.

DEA 230/231 Epsilon with different sensor types for measuring the curing behavior of various reactive industrial resins, professional adhesives and coatings – also on-line.

LFA 447 NanoFlash® for the determination of thermal conductivity – also for multi-layer and anisotropic components.

Come to visit us in hall B5 at the joint booth No. 161 hosted by Bayern Innovativ; we will be pleased to talk with you about your requirements for applications in product development, quality assurance, failure analysis and process optimization!