Model 8000 Mask Aligner and Exposure Tool OAI
The system is available as a manual or fully automated mask aligner, and is capable of performing sub-micron, level-to-level alignment and double sided lithography. It's flexible design allows printing on various substrates - round or square - up to 300mm. The exposure system is compatible with photoresist in Near, Mid or Deep UV range.
This versatile mask aligner for double sided lithography is engineered for a wide variety of process applications. With it's proven, modularized design, it delivers the scalability required to accommodate changing process parameters. This automated mask aligner is designed primarily as a full production tool; the manual version is well adapted to low volume production, short-run engineering, or R&D applications. The tool may be used in proximity, contact or vacuum modes. Other notable features include auto pre-aligner, intensity controlling power supply system and ,dual zoom CCD TV exposure lamp power up to 5000W and a low-maintenance design.
FEATURES AND SPECIFICATIONS
• Front side - back side submicron printing and alignment
• Mask size up to 10"x10"
• User-selectable substrate-to-mask pressure
• Proximity, soft and soft-through-hard vacuum contact
• Alignment accuracy 0.5µm top side - 1.0µm back side
• Automated sequences as well as fully manual operation
• Lamp power: 350W, 500W, 1000W, 2000W, 5000W
• High efficiency, uniform, exposure w/ Intensity controlling power supply
• Microscope: dual zoom, CCD TV camera
• Throughput >100wph
09 July 2010
