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Press release from Taiyo Yuden Europe - 2008-05-29

Launching EIA0201 Size Multilayer Chip Ferrite Beads for Power Circuits

Use of Advanced Multilayer and Printing Technologies Shrinks Chip
Surface Area by 64%|

Taiyo Yuden Co., Ltd. announces sale of the EIA0201 size multilayer chip ferrite bead BKP0603 (0.6x0.3x0.3mm), which will reduce power circuit noise in mobile phones and other mobile equipment. Compared with the previous EIA0402 size BKP1005 (1.0x0.5x0.5mm), the chip surface area has been reduced by 64%.
This product responds to demands for the smaller multilayer chip ferrite beads for power circuits that serve for both multiple functionality and more compactness in mobile phones and other mobile equipment, by achieving a rated current of 1.0A and a Rdc of 65mĦ in the 0201 size (impedance 22Ħ).
Mass production is to commence in May 2006, at a sample price of 5 yen per unit.
The mobile phone market is expanding everywhere all over the world, and the trend is toward more compact size and multiple functionality. With the trend to multiple functionality, the number of IC chips used per phone has increased, and power supply specifications circuits have increasingly been mounted on
each IC chip to make power use more efficient toward the goal of reducing power consumption.
However, increasing the number of power supply circuits tends to increase the productfs size. As a result, there have been demands to reduce the size of the main components within the DC-DC converters, or the power supply circuits mounted on the equipment, as a way to forestall this tendency.
However, since the multilayer chip ferrite beads used to reduce noise in the DC-DC industrial converter decline in rated current and Rdc performance as they become smaller in size, and thereby become unable to handle large current, they were an obstacle toward achievement of the desired characteristics at the more compact size. At this point, Taiyo Yuden made further advances in its multilayer and printing technologies to achieve multilayer chip ferrite beads in the EIA0201 size (0.6x0.3x0.3mm), a
reduction of 64% in chip surface area from the previous EIA0402 size (1.0x0.5x0.5mm).


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detail-comm news di En 2008-09-36-05