Chip Industrial coolers provides unique cooling solutions for a variety of BGA semiconductor packages. The product line has expanded to accommodate the increasing speed and heat of today's BGA semiconductors.

Chip Coolers has invented an exclusive heat sink attachment method that allows for quick, clean and replaceable mounting to virtually every BGA semiconductor package. The attachment mechanism, which is a mounting clip, does not add any additional height to the heat sink. The clip attaches to the BGA semiconductor package using the patented CoolSnap method.

Cool Link is our thermally conductive interface which is a standard feature of the heat sink. It is applied with a silk-screening process and cured with ultra violet light. It is a special blend of graded boron nitrite that is capable of continuous service up to 281°C with no breakdown or separation of components.